In future high-tech industries, such as high-speed optical computing for massive AI, quantum cryptographic communication, and ...

3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...

ANSYS Inc.’s ANSS flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs ...

You’re probably familiar with the little black boxes nestled neatly inside your favorite devices. With their diminutive size and unassuming characteristics, it can be hard to believe these vessels are ...

Scientists are working on a prototype system composed of integrated circuit #d technology that they say will help create human tissues for people with congenital defects or serious internal organ ...

Researchers reported a deposition process for nanosheet oxide semiconductor. The atomic layer deposition technique was demonstrated for producing field effect transistors for 3D integrated circuits at ...

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

Osaka, Japan – Scientists from the Flexible 3D-System Integration Laboratory at Osaka University developed a new method for the direct three-dimensional bonding of copper electrodes using silver, ...

This is where 3D circuits, also known as 3D-MID (Mechatronic Integrated Device), come in. This exciting technology integrates circuits directly into 3D-molded plastic. Imagine the housing of your ...

image: Researchers from Institute of Industrial Science, The University of Tokyo develop a nanosheet oxide semiconductor for electronic devices view more Tokyo, Japan – 3D integrated circuits are a ...