Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

Kyocera America Inc., a subsidiary of Kyocera International Inc., today introduced what it said is the first flip-chip build-up substrate that is capable of withstanding 260 degrees C solder reflow ...

So, you’re trying to get a handle on BGA flip chip tech? It’s one of those things that sounds complicated, but once you break ...

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down ...

Samsung Electro-Mechanics has raised prices for its high-end flip-chip ball grid array (FC-BGA) substrates as demand from ...

The expansion of demand for artificial intelligence (AI) is energizing industries across the board. One of the hottest ...

Japanese IC substrate manufacturer Shinko Electric Industries has announced that due to poor sales of its main product, flip chip packaging substrates, the upcoming fiscal report for the fiscal year ...

The use of lead solder in electronic products is destined to become outlawed soon, forcing manufacturers to find an alternative. Pioneering work by scientists at Imperial College, London, UK, has led ...