Presenting the new, .050” (1,27 mm) pitch solder cup headers and sockets for termination of fine gauge wires and cables. These solder cup connectors are ideal for applications that demand a highly ...

Mill-Max is expanding its line of wire termination interconnects with new socket and header strips rated at 4.5 amps per contact. Mill-Max is expanding its line of wire termination interconnects with ...

Using a new high-performance elastomer, the SM-QFN-9019 QFN socket is designed for 13 x 19-mm mixed-pitch QFN packages and operates at bandwidths to 40 GHz with less than 1dB of insertion loss. The ...

What’s the difference between a 64k ROM in a 28-pin DIP and a 128k ROM in a 32-pin DIP? Aside from the obvious answers of “64k” and “four pins,” it turns out that these two chips have a lot in common, ...

The Giga-snap SFS-BGA200B-52 socket allows an 11 x 14.5-mm, 200-ball BGA IC with a 0.65-mm pitch, 12 x 22-array to be placed in a socket with the same footprint as the IC to avoid compromising ...

Series 700, 0518, and 0501 RoHS-compliant sockets are specifically designed for high-pin-count or off-centered components for socketing DIPs with nonstandard row-to-row dimensions and elevating ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...