EDN

New CMP process for sub-100nm copper and low-k wafers

ACM Research, a two-year-old Californian company, says it can see the end of the road for chemical mechanical polishing (CMP), and is looking to move in on the market with a non-contact process. It ...
AZOM

Using 3D Optical Profiling for Full-Field Hotspot Detection

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...
EDN

Lam says new platen controls CMP processes within 2 mm of wafer’s edge

FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...
The Desert Sun

SiC Wafer Processing Market Expansion Accelerates, Projected to Reach US$ 2,986.44 Million by 2032

This will expand the role of advanced CMP consumables, high-precision metrology, and contamination control. Epi wafers gain strategic value As device architectures become more demanding, epi quality ...
Business Insider

REVASUM (ASX:RVS) announces the release of a 200mm conversion kit for their flagship 6EZ silicon carbide (SiC) chemical mechanical polishing (CMP) platform

SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...
Machine Design

Next-generation plastics let wafers fly through manufacturing

As demand for device slips below 0.18m m, are relying more machinable help get silicon wafers through the fab line quickly with less consumable costs and fewer defects per wafer. OEMs and fabs want to ...